Samsung, Broadcom strike massive $200 billion AI chip deal through 2030

The announcement was made during the AI Summit at The Midway in San Francisco. The event was attended by Jinman Han, President and Head of Samsung Electronics' Foundry Business; Hock Tan, President and CEO of Broadcom; senior executives from both companies; and representatives of the South Korean government.

Under the agreement, the two companies expect their collaboration to exceed $200 billion across memory and foundry businesses over the next five years, through 2030.

As part of the expanded partnership, Samsung and Broadcom will deepen their collaboration on advanced memory technologies, including the supply of industry-leading High Bandwidth Memory (HBM) solutions to support Broadcom's next-generation AI accelerators.

In the foundry segment, the companies will work together on Samsung's cutting-edge 2-nanometer (2nm) and more advanced process technologies for Broadcom's products, including Wireless Broadband Communications (WBC) solutions. The partnership will also extend to advanced packaging technologies based on Samsung's 2nm process, including 2.3D and 2.5D integration, designed to deliver higher-performance, more power-efficient AI and networking chips.

"AI is driving unprecedented demand for tightly integrated semiconductor technologies spanning memory, logic and advanced packaging," said Young Hyun Jun, Vice Chairman and CEO of Samsung Electronics' Device Solutions (DS) Division.

"By expanding our collaboration with Broadcom across these critical technologies, we look forward to delivering greater value to customers while advancing the AI infrastructure of the future," he added.

Broadcom also underscored the growing importance of industry collaboration as AI infrastructure scales rapidly.

"As AI infrastructure continues to scale, close collaboration across the semiconductor ecosystem becomes increasingly important," said Charlie Kawwas, President of Broadcom's Semiconductor Solutions Group.

"By combining Samsung's memory and foundry expertise with Broadcom's AI and connectivity leadership, we aim to continue delivering technologies that power the next generation of AI infrastructure," he said.

Samsung said its broad capabilities spanning memory, logic, foundry and advanced packaging uniquely position the company to provide integrated semiconductor solutions for the AI era. The expanded partnership with Broadcom, it added, reflects its commitment to delivering end-to-end semiconductor technologies for an increasingly diverse range of AI and high-performance computing applications.