Samsung and ASML join forces for next-gen chips in major AI era push

Building on years of cooperation, the two companies will work together to accelerate the development and deployment of technologies designed to meet the growing performance and efficiency demands of advanced semiconductor manufacturing.

As part of the expanded partnership, Samsung will join an industry initiative focused on advancing next-generation 12-inch photomask technology for future semiconductor manufacturing.

The semiconductor industry has relied on the 6-inch photomask format for decades. With the introduction of High NA EUV lithography, the transition to larger 12-inch masks is expected to improve fab productivity, reduce chipmaking costs and overcome stitching constraints.

The shift will allow advanced chipmakers to more fully leverage the benefits of High NA EUV, potentially making future generations of leading-edge chips more cost-effective.

Drawing on its leadership in memory and foundry manufacturing, along with extensive experience in advanced EUV lithography, Samsung is expected to play a key role in the transition to 12-inch photomasks. The company will work with industry partners to develop the required mask technologies and supporting infrastructure.

Samsung also plans to introduce ASML’s High NA extreme ultraviolet (EUV) lithography into future DRAM high-volume manufacturing by 2028, which would make it the first company in the industry to do so, according to the announcement.

High NA EUV is expected to extend the DRAM scaling roadmap, with improved resolution potentially enabling process simplification and greater manufacturing efficiency.

The expanded partnership reflects the companies’ shared focus on technological innovation, industry leadership and long-term collaboration. Samsung and ASML said they will continue exploring additional areas of cooperation, including advanced memory technologies and innovative manufacturing approaches.

Young Hyun Jun, Vice Chairman and CEO of Samsung Electronics, said the AI era is transforming the semiconductor industry and increasing the importance of technological innovation across the entire value chain.

“Samsung is committed to maintaining leadership in advanced semiconductor manufacturing, including memory and foundry, through breakthrough technologies and strong partnerships. By further strengthening our collaboration with ASML, we are helping lay the foundation for the next generation of AI and semiconductor innovation,” he said.

Christophe Fouquet, President and CEO of ASML, said Samsung has been one of the company’s most important innovation partners for many years.

“Together, we have helped advance the technologies that underpin modern semiconductor manufacturing. As the industry enters a new era driven by artificial intelligence, close collaboration with our customers becomes even more important. We look forward to working with Samsung to enable the next wave of semiconductor innovation,” he said.